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2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 1 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited general description the AA4006 is a class ab stereo audio power ampli- fier with headphone driver, which can deliver 2.7w into 3 ? speakers with 5.0v power supply and thd+n less than 10%. it is designed specially for notebook pc and portable media player applications. the AA4006 features stereo full differential input or 2 sets of stereo single-ended audio input. there are 4 dif- ferent gain settings at btl mode -6db, 10db, 15.6db and 21.6db, changed by setting gain0, gain1 pins. at se mode, the gain is fixed 4.1db. the AA4006 can amplify square waveform beep input signal from beep_in pin and its' output can always reach btl terminal, masking all other audio inputs regardless of whether the chip is in shutdown, se or btl mode. the AA4006 is available in tssop-24 (edp) package . features output power, thd+n=10%: 110mw at se mode for 32 ? headphone 220mw at se mode for 16 ? headphone 1.5w at btl mode for 8 ? speaker 2.3w at btl mode for 4 ? speaker 2.7w at btl mode for 3 ? speaker supply voltage range: 4.5v to 5.5v 4 selectable internal fixed gain setups stereo 2:1 input multiplexer stereo full differential input pc beep input low power consumption at shutdown mode 150 a typical excellent click/pop noise suppression thermal shutdown protection applications notebook pc portable media player figure 1. packages type of AA4006 tssop-24 (edp)
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 2 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited pin configuration g package ( tssop-24 (edp )) figure 2. pin configuration of AA4006 (top view) shutdown gnd outl+ pvdd outl- l_line_in gain0 l_in hp _ sense gnd outr+ hp_line outr- beep_in bypass r_in pvdd 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 15 14 13 18 17 16 21 20 19 gain1 l_hp_in gnd gnd vdd r_hp_in r_line_in
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 3 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 pin description pin number pin name function 1, 12, 13, 24 gnd ground reference, it is better to connect with thermal pad 2 gain0 internal gain setup 0, see table 1 below 3 gain1 internal gain setup 1, see table 1 below 4 outl+ left channel positive output 5 l_line_in left channel line input 6 l_hp_in left channel headphone input 7, 18 pvdd power supply for output stage 8 r_in right channel common input for di fferential input, ac ground for single-ended input 9 outl- left channel negative output 10 l_in left channel common input for diff erential input, ac ground for sin- gle-ended input 11 bypass internal reference volta ge pin, connect a 1.0 f ceramic capacitor to gnd 14 beep_in beep signal input pin 15 hp_sense se, btl mode switch pin, l C btl mode, h C se mode 16 outr- right channel negative output 17 hp_line headphone, line input select pin, l C line input, h C headphone input 19 vdd power supply for other analog circuit 20 r_hp_in right channel headphone input 21 outr+ right channel positive output 22 shutdown shutdown mode select, l C shutdown enable, h C shutdown disable, normal work 23 r_line_in right channel line input
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 4 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited circuit type AA4006 - package temperature range part number marking id packing type lead free green lead free green tssop-24 (edp) -40 to 85 o c AA4006gtr-e1 AA4006gtr-g1 AA4006g AA4006g-g1 tape & reel package tr: tape and reel ordering information gain0 gain1 hp_sense mode gain l l l btl 6db l h l btl 10db h l l btl 15.6db h h l btl 21.6db x x h se 4.1db table 1: gain vs. gain0, gain1 logic level g: tssop-24 (edp) g1: green bcd semiconductor's pb-free products , as designated with "e1" suffix in the part number, are rohs compliant. products with "g1" suffix are available in green packages. e1: lead free
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 5 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 absolute maximum ratings (note 1) note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functiona l operation of the device at these or a ny other conditions beyond those indicated i n the operation is not implied. exposure to "absolute maximum ratings" for extended periods may af fect device reliability. note 2: chip is soldered to 100mm 2 (4mm x 25mm) copper (top side solder mask) of 1oz. on pcb with 16 x 0.5mm vias. recommended operating conditions parameter symbol min max unit supply voltage v dd 4.5 5.5 v operating ambient temperature t a -40 85 o c parameter symbol value unit supply voltage v dd 6v input voltage v in -0.3 to v dd + 0.3 v power dissipation p d internally limited package thermal resistance (note 2) ja 65 o c/w operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10 sec) t lead 260 o c esd (human body model) 2000 v esd (machine model) 200 v parameter symbol conditions min typ max unit quiescent current i dd se mode, v in =0, i o =0 3.5 7 ma btl mode, v in =0, i o =0 6.5 12 shutdown current i sd v shutdown =0v 150 300 a high logic level hp_sense, hp_line v ih 4.0 v gain0, gain1 3.0 v electrical ch aracteristics pv dd =v dd =5.0v, gain = 6db @ btl mode, 4.1db @ se mode, t a =25 o c, f=1 khz, 20 khz low pass filter, for se mode, hp_sense=5.0v, for btl mode, hp_sense=0v, unless otherwise specified.
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 6 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited parameter symbol conditions min typ max unit high logic level shutdown v ih 2.0 v low logic level hp_sense, hp_line v il 3.0 v gain0, gain1 2.0 v shutdown 0.8 v thermal shutdown temperature 165 o c hysteresis temperature window 35 o c beep input amplitude v bp 2.5 v p-p gain g bp c bp =0.47 f, f=1khz, d=50% square wave form, v bp =3.3vp-p 0.3 v/v se mode output power p o thd+n=1%, r l =32 ? 90 mw thd+n=10%, r l =32 ? 110 thd+n=1%, r l =16 ? 180 thd+n=10%, r l =16 ? 220 total harmonic distortion + noise thd+n p o =75mw, r l =32 ? 0.03 % signal to noise ratio s/n p o =75mw, r l =32 ? 95 db crosstalk x talk f=1khz -90 db power supply rejection ratio psrr c b =1 f, f=1khz, v ripple =0.2v rms 60 db output noise v no f=20hz to 20khz, r l =32 ? 20 v rm btl mode output offset voltage v in =0v, no load 5 25 mv output power p o thd+n=1%, r l =3 ? 2.1 w thd+n=10%, r l =3 ? 2.7 thd+n=1%, r l =4 ? 1.8 thd+n=10%, r l =4 ? 2.3 thd+n=1%, r l =8 ? 1.2 thd+n=10%, r l =8 ? 1.5 total harmonic distortion + noise thd+n p o =1w, r l =4 ? 0.08 % signal to noise ratio s/r p o =1w, r l =4 ? 100 db crosstalk x talk f=1khz -100 db power supply rejection ratio psrr c b =1 f, f=1khz, v ripple =0.2v rms 70 db output noise v no f=20hz to 20khz, r l =8 ? 18 v rm electrical characteristics (continued) v dd =5.0v, gain = 6db @ btl mode, 4.1db @ se mode, t a =25 o c, f=1khz, 20khz low pass filter, for se mode, hp_sense=5.0v, for btl mode , hp_sense=0v, unless otherwise specified.
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 7 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 typical performance characteristics figure 3. quiescent current vs. supply voltage figure 4. shutdown current vs. supply voltage figure 5. bypass voltage vs. supply voltage fi gure 6. thd+n vs. output power 4.55.05.56.0 0 1 2 3 4 5 6 7 8 9 10 se mode btl mode quiescent current (ma) supply voltage (v) v in =0v no load 0123456 0.0 0.5 1.0 1.5 2.0 2.5 3.0 bypass voltage (v) supply voltage (v) 10m 100m 0.01 0.1 1 10 50m thd+n (%) output power (w) v dd =5.0v, se mode r l =16 ? , f=1khz 20khz lpf 400m 4.5 5.0 5.5 6.0 0 25 50 75 100 125 150 175 200 225 250 275 300 shutdown current_i sd ( a) supply voltage_v dd (v) v in =0 i out =0 v shutdown =0
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 8 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited figure 8. thd+n vs. output power figure 7. thd+n vs. output power figure 9. thd+n vs. output power figure 10. thd+n vs. frequency typical performance ch aracteristics (continued) 100 1k 10k 1e-3 0.01 0.1 1 10 p o =75mw p o =50mw 20 thd+n (%) frequency (hz) v dd =5.0v, se mode r l =32 ? , 30khz lpf c out =220 f 20k p =25mw 10m 100m 0.01 0.1 1 10 50m thd+n (%) output power (w) v dd =5.0v, se mode r l =32 ? , f=1khz 20khz lpf 200m 10m 100m 1 0.01 0.1 1 10 thd+n (%) output power (w) 3 btl mode, r l =4 ? f=1khz, 20khz lpf v dd =5.5v v dd =5.0v 10m 100m 0.01 0.1 1 10 f=1khz f=100hz thd+n (%) output power (w) v dd =5.0v, se mode r l =32 ? , 30khz lpf 200m f=10khz
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 9 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 figure 12. thd+n vs. output power figure 11. thd+n vs. output power figure 13. thd+n vs. output power figure 14. thd+n vs. output power typical performance ch aracteristics (continued) 10m 100m 1 0.01 0.1 1 10 thd+n (%) output power (w) v dd =5.0v, btl mode r l =8 ? , f=1khz gain=6db, 20khz lpf 2 10m 100m 1 0.01 0.1 1 10 gain=10db gain=6db gain=15.6db thd+n (%) output power (w) v dd =5.0v, btl mode r l =4 ? , f=1khz 20khz lpf 4 gain=21.6db 10m 100m 1 0.01 0.1 1 10 thd+n (%) output power (w) v dd =5.0v, btl mode r l =3 ? , f=1khz gain=6db, 20khz lpf 4 10m 100m 1 0.01 0.1 1 10 thd+n (%) output power (w) v dd =5.0v, btl mode r l =4 ? , f=1khz gain=6db, 20khz lpf 4
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 10 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 15. thd+n vs. output po wer figure 16. thd+n vs. frequency 100 1k 10k 1e-3 0.01 0.1 1 10 p o =1.0w p o =0.25w 20 thd+n (%) frequency (hz) v dd =5.0v, btl mode r l =3 ? , gain=6db 30khz lpf 20k p o =1.75w 100 1k 10k 1e-3 0.01 0.1 1 10 20 p o =0.25w p o =1.0w thd+n (%) frequency (hz) v dd =5.0v, btl mode r l =4 ? , gain=6db 30khz lpf 20k p o =1.5w 100 1k 10k 1e-3 0.01 0.1 1 10 p o =0.25w p o =0.5w 20 thd+n (%) frequency (hz) v dd =5.0v, btl mode r l =8 ? , gain=6db 30khz lpf 20k p o =1.0w 10m 100m 1 0.01 0.1 1 10 f=20hz f=1k f=10k thd+n (%) output power (w) v dd =5.0v, btl mode r l =4 ? , gain=6db 30khz lpf 4 f=10k figure 17. thd+n vs. frequency figure 18. thd+n vs. frequency
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 11 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 19. thd+n vs. output power figure 20. psrr vs. frequency figure 21. psrr vs. frequency figure 22. thd+n vs. frequency 10m 100m 1 0.01 0.1 1 10 thd+n (%) output power (w) 3 btl mode, r l =4 ? f=1khz, 20khz lpf v dd =5.5v v dd =5.0v 100 1k 10k -90 -80 -70 -60 -50 -40 -30 -20 -10 0 20 psrr (db) frequency (hz) v dd =5.0v, se mode cb=1.0 f, r l =32 ? v ripple =0.2v rms input ac ground 20k 100 1k 10k -90 -80 -70 -60 -50 -40 -30 -20 -10 0 20 psrr (db) frequency (hz) v dd =5.0v, btl mode cb=1.0 f, r l =8 ? v ripple =0.2v rms input ac ground 20k 100 1k 10k -140 -120 -100 -80 -60 -40 -20 0 right -> left 20 crosstalk (db) frequency (hz) v dd =5.0v, se mode p o =75mw, r l =32 ? 20k left -> right
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 12 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 26. thd+n vs. common mode input voltage figure 25. gain vs. frequency figure 23. crosstalk vs. frequency figure 24. gain vs. frequency 100 1k 10k -140 -120 -100 -80 -60 -40 -20 0 right -> left 20 crosstalk (db) frequency (hz) v dd =5.0v btl mode r l =8 ? , p o =1.0w 20k left -> right 100 1k 10k 4 6 8 10 12 14 16 18 20 22 24 20 gain (db) frequency (hz) v dd =5.0v, btl mode r l =8 ? , c in =1.0 f 20k gain0, gain1=h, h gain0, gain1=h, l gain0, gain1=l, h gain0, gain1=l, l 100 1k 10k -6 -4 -2 0 2 4 6 r l =10k ? r l =32 ? 20 gain (db) frequency (hz) v dd =5.0v, se mode c in =1.0 f, c out =220 f 20k r l =16 ? 012345 0.01 0.1 1 10 thd+n (%) common mode input voltage (v) v dd =5.0v, btl mode differential input r l =8 ? , f=1khz p=1.0w
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 13 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 typical performance ch aracteristics (continued) figure 27. thd+n vs. output voltage figure 28. pop noise at se mode ch1 (v dd =5v, se mode, r l =32 ? , c b =1.0 f, c in =0.47 f, c out =220 f, ch1=v shutdown , ch2=v bypass , ch3=v out at r l ) ch2 ch3 100m 1 0.01 0.1 1 10 thd+n (%) output voltage (v) v dd =5.0v, se mode r l =10k ? , c out =220 f c in =1.0 f, f=1khz 3
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 14 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited application information se/btl mode, hp_sense pin the AA4006 can operate under 2 types of output con- figuration, se (single-ended) mode and btl (bridged tied load) mode, determined by hp_sense pin's logic level. (here is the discussion about left channel only, it can equally ap ply to right channel.) when hp_sense pin is held low which sets the chip in btl mode, both amp1 and amp2 are turned on. amp2 has the same gain with amp1 except 180 degree phase shift. because the dc component (output bias voltage from amp1 and amp2, approx. 1/2 v dd ) between out+ and out- is canceled, there is no necessity to use dc block capacitors for speaker load. in btl mode, output voltage swing across load is about 2 times that in se mode, so there is about 4 times output power compared to se mode with same load and input. (see figure 29) if applying high level to hp_sense pin which sets the chip in se mode, amp2 unit is turned off with high impedance. there is no current loop between out+ and out-, the speaker is naturally disabled without any hardware change. the output audio signal rides on bias voltage at out+ (output bias voltage from amp1 and amp2, approx. 1/2 v dd ), so it has to use a capaci- tor c out to block dc bias voltage and couple ac sig- nal to headphone load. it is recommended to conn ect hp_sense to the head- phone jack switch pin illustrated in figure 29. when headphone plug is not inserted, the voltage of hp_sense pin is determined by voltage divider formed by r l and r 12 . for given resistors' value in figure 29, r l =1k ? , r 12 =100k ? (assuming v dd =5.0v), dc voltage at hp_sense node is about 49.5mv. ac signal equals output amplitude of out+ through c out , the maximum peak-peak voltage is no greater than v dd , so the positive maximum voltage of hp_sense node will be no greater than 2.5v+49.5mv=2.55v(dc voltage plus ac voltage), which is less than hp_sense input high level mini- mum value (4.0v). that mean s the chip works in btl mode reliably and there is no risk of operation mode switch between se and btl. when headphone plug is inserted, as the r l is disconnected from r 12 , the volt- age of hp_sense pin is pulled up by r 12 to v dd sets the chip in se mode. hp_sense pin can also be connected to mcu i/o port directly to switch the operation mode between se and btl. input mux, single-ended input and differ- ential input the AA4006 offers the capability to use 2 individual stereo inputs: headphone input and line input. for a single-ended input, the common input terminal pins (l_in, r_in) should be connected to ground through a figure 29. input mux and output configuration for left channel left out+ left out- + _ 4 9 + c out 220 f r l 1k ? amp1 amp2 sleeve headphone jack left line in c in 0.47 f gain control mux left hp in c in 0.47 f c in 0.47 f + _ 5 6 10 17 hp/line gain0 2 gain1 3 hp-sense 15 v dd r1 100k ? r12 100k ? left in
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 15 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 capacitor, also the size of c lin (c rin ) has to be the same as c llin (c rlin ), c lhpin (c rhpin ). line input and headphone input are selected by switching hp_line pin. when hp_line is pulled high, the headphone input (l_hp_in, r_hp_in) is selected. when hp_line is held low, the line input (l_line_in, r_line_in) is selected. if the input sig- nals are differential, only one stereo signal is permitted because share common input terminal pin (l_in, r_in), both headphone input and line input can be formed into differential pair with common input termi- nal. (see figure 31) with differential input configuration, the input cou- pling capacitors of differential pair can be removed if dc bias voltage of input source is within input com- mon- mode voltage range, refer to figure 26. c in , c out , c b and c s (power supply) selection although there is no necessary to use input coupling capacitors in differential input if dc voltage of input is within common-mode input voltage range. the AA4006 allows using input capacitors c in to accom- modate different dc level between input source(like audio d-a converter) and bias voltage (about 1/2 v dd ), especially in single-ended input mode which is popularly used in most applications. input stage of AA4006 is illustrated as figure 33, it is a full differen- tial architecture, which cons ists of input resistor, r in and feedback resistor, r fb . in se mode, pass-band gain is, in btl mode, pass-band gain is, ...................................................(1) in fb se r r gain = ............................................(2) in fb btl r r gain ? = 2 application information (continued) left out+ left out- + _ 4 9 amp1 amp2 left line in c llin 0.47 f gain control mux left hp in c lhpin 0.47 f c lin 0.47 f + _ 5 6 10 hp_line 17 gain0 2 gain1 3 hp_sense 15 left in + _ amp4 amp3 right line in c rlin 0.47 f gain control mux right hp in c rhpin 0.47 f c rin 0.47 f + _ 23 20 8 right in right out- 16 right out+ 21 figure 30. single-ended input
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 16 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 figure 31. differential input with input coupling capacitors application information (continued) left out+ left out- + _ 4 9 amp1 amp2 c llin 0.47 f gain control mux left hp in- c lhpin 0.47 f c lin 0.47 f + _ 5 6 10 hp_line 17 gain0 2 gain1 3 hp_sense 15 + _ amp4 amp3 c rlin 0.47 f gain control mux right hp in- c rhpin 0.47 f c rin 0.47 f + _ 23 20 8 right out- 16 right out+ 21 left hp in+ right hp in+ v dd left out+ left out- + _ 4 9 amp1 amp2 left line in- c llin 0.47 f gain control mux c lhpin 0.47 f clin 0.47 f + _ 5 6 10 hp_line 17 gain0 2 gain1 3 hp_sense 15 + _ amp4 amp3 right line in- c rlin 0.47 f gain control mux c rhpin 0.47 f c rin 0.47 f + _ 23 20 8 right out- 16 right out+ 21 left line in+ right line in+ a) using line_in b) using hp_in
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 17 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 left out+ left out- + _ 4 9 amp1 amp2 left line in- gain control mux c lhpin 0.47 f + _ 5 6 10 hp_line 17 gain0 2 gain1 3 hp_sense 15 + _ amp4 amp3 right line in- gain control mux c rhpin 0.47 f + _ 23 20 8 right out- 16 right out+ 21 left line in+ right line in+ left out+ left out- + _ 4 9 amp1 amp2 c llin 0.47 f gain control mux left hp in- + _ 5 6 10 hp_line 17 gain0 2 gain1 3 hp_sense 15 + _ amp4 amp3 c rlin 0.47 f gain control mux right hp in- + _ 23 20 8 right out- 16 right out+ 21 left hp in+ right hp in+ v dd figure 32. differential input without input coupling capacitors application information (continued) a) using line_in b) using hp_in
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 18 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited the typical input resistan ce, feedback resistance of AA4006 at each gain setting are showed in the table below. input capacitors c in and input resistors r in form a first order high pass filter, which determines the lower cor- ner frequency according to the equation below. it is a little different from the classic equation accord- ing to figure 34. input resistance varies with gain setting, also the abso- lute resistance of r in may drift 20% due to fab pro- cess. to ensure the minimum cut-off frequency within the audible range, the input capacitor (c in ) has to be greater than 0.33 f. the low esr ceramic capacitor of 0.47 f is recommended. see figure 35 for frequency response using 0.47 f c in . however, using bigger size of c in will affect pop noise of AA4006. if using an external resistor r ext in series with input capacitor c in , the closed-loop gain and cut-off frequency can be calculated by equations below. .................................................(3) in in cil c r f * 2 2 = gai n0 gai n1 hp_s ense gain (db) r in ( ? )r fb ( ? ) 00 0 6 90 90 0 1 0 10 70 110 1 0 0 15.6 45 135 1 1 0 21.6 25 154 x x 1 4.1 70 110 figure 33. full differential input stage of AA4006 figure 34. input configuration with input capacitor, c in amp1 amp2 internal external r in r in r in r in + - + - + - out out r fb r fb r fb r fb - + v bias amp1 amp2 internal external r in r in r in r in + - + - + - out out r fb r fb r fb r fb - + v bias c in c in amp1 amp2 internal external r in r in r in r in + - + - + - out out r fb r fb r fb r fb - + v bias c in c in c in c in application information a) AA4006 input configuration with input capacitor b ) classic input configuration with input capacitor
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 19 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 10 100 1k 10k 4 6 8 10 12 14 16 18 20 22 gain=6db gain=10db gain=15.6db gain (db) frequency (hz) v dd =5.0v, btl mode c in =0.47 f, r l =10k ? 30k gain=21.6db similarly, for output stage in se mode, output capacitor (c out ) and headphone load (r hp ) also form a first order high pass filter, and its lower cut-off frequency is determined by equation 6. the purpose of the bypass capacitor (c b ) is to filter noise, reduce total harmonic distortion plus noise, and improve power supply rejection ratio performance. tantalum or ceramic capacitor of 1.0 f with low esr is recommended, and it should be placed as close as possible to the chip in pcb layout. this capacitor affects the pop noise perfor mance furthest by changing the ramp of charge and/or discharge. the below table shows output noise in each gain under the condition of 1.0 f bypass capacitor. unit: vrms. ...........................(4) in ext btl r r gain + ? ? = 2 r 2 fb ...............................(5) () in in ext cil c r r f + = 2 2 2 c out ( f) headphone load ( ? ) lower cut-off frequency (hz) 220 16 45.2 220 32 22.6 330 16 30 330 32 15 filter: 22hz ~ 22khz a- weight ed filter se mode c out =220 f, r l =16 ? 22 16 c out =220 f, r l =32 ? 23 17 btl mode r l = 4 ? gain0, gain1 = 0, 0 18.5 13.5 gain0, gain1 = 0, 1 23 17 gain0, gain1 = 1, 0 32 24.5 gain0, gain1 = 1, 1 46.5 37 r l = 8 ? gain0, gain1 = 0, 0 19 14 gain0, gain1 = 0, 1 24 18 gain0, gain1 = 1, 0 33.5 25.5 gain0, gain1 = 1, 1 52 39 .............................................(6) out hp col c r f * 2 1 = figure 35. frequency response using 0.47mf input capacitor figure 36. using an external resistor, r ext in series with input capacitor, c in amp1 amp2 internal external r in r in r in r in + - + - + - out out r fb r fb r fb r fb - + v bias c in c in r ext r ext application information
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 20 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited for AA4006 power supply, it is better to use an individual power source generated from voltage regulator split from video, digital circuit units in system. for power supply bypass capacitor (c s ), it is recommended to use one low esr electrolytic or tantalum capacitor from 4.7 f to 10 f in parallel with 0.1 f ceramic capacitor which is located close to the chip. shutdown AA4006 has a shutdown feature to reduce power consumption during non-use operation. if apply low level to shutdown pin, output amplifiers, bias circuit will be turned off, the current drawn from v dd is about 100 a. however, the beep detect circuitry is always ready to give alert on sp eaker load once apply any valid signal into beep_in pin. the shutdown pin should be pulled high during normal operation, and it should never be left floating to prevent the unpredictable status of the chip. however, the music signal will be output instantly once the shutdown pin is applied to logic level from low to high. when the shutdown pin changes from high to low, output will be present until bias voltage drops to approx 0.1v. see figure 37 for time relationship between shutdown, bias voltage and output. optimizing click/pop noise the AA4006 includes optimized circuits to suppress click/pop noise during power up/power down transition. in btl mode, AA4006 can reduce most common mode signal also including click/pop noise due to symmetrical output. in se mode, optimized ramp for rise/fall edge of bias can significantly reduce click/pop noise generated by output capacitor (c out ) charge and/or discharge. smoothing rise/fall edge of dc bias voltage is a quite important method. another way is to prolong charge/ discharge time which can shape power spectrum of output, and this makes some frequencies outside of the human audible range (20hz to 20 khz). so external components (including c b , c in , c out and headphone load) will affect pop noise performance. the recommended components are, c b =1.0 f, c in =0.47 f, c out =220 f, 32 ? for headphone load. under given conditions, the maximum peak-peak voltage of pop noise is less than 15mv(see figure 28). if using 16 ? headphone, the voltage of pop noise will decrease accordingly. beep input beep input feature is used in computer system for alerting. a beep signal can be sent directly from a computer. if peak-peak voltage of beep signal applied to beep_in pin (pin14) exceeds a certain voltage (typical 1/2 v dd ), the feature will be activated automatically, then AA4006 will be forced in btl mode with the fixed gain of 0.3v/v, both line_in and hp_in are deselected, the logic level of hp_sense, hp_line, gain0, gain1 and shutdown is ignored. once beep signal is removed from the chip, the AA4006 will return to the previous operation mode, gain settings. the preferred beep signal is a square wave or pulse train, the preferred input is dc-coupled. if using ac- coupled, assuming beep input capacitor is 0.47 f, the input voltage is 3.3 vp-p square wave, the beep signal should have a minimum of 10 cycles. power dissipation, efficiency and thermal design consideration for class ab amplifiers, equation 7 is the basic equation of efficiency worked in btl mode, here v p is output peak voltage across the load. thermal dissipation becomes major concern when delivering more power into speaker especially in btl mode. the maximum allowed power dissipation can be calculated by equation below which is determined by thermal resistance of AA4006 package. dd v vp 4 = .............................................................(7) application information (continued)
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 21 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 here t jmax is maximum operating junction temperature of 150 o c , t a is ambient temperature, ja is thermal resistance from junction to ambient. for tssop-24(edp) package, it is 65 o c /w given in datasheet. assuming t a is 25 o c , the maximum allowed power dissipation is about 1.92w according to equation 8. there is another equation about power dissipation which is determined by power supply voltage and load resistance under a certain application. the above equation expresses total power dissipation, dominated by dual channels, quiescent current. it is a quadratic equation with th e negative coefficient of output voltage variation (v p ), there is always a maximum showed as below. if power dissipation calculated by application is larger than the package permitted , it is necessary to use larger copper plane under the chip, or assemble an additional heat sink, or use forced-air cooling to keep ambient temperature around th e chip low, or increase load resistance, or decr ease power supply voltage. for example, assuming v dd =5.0v, speaker load r sp =4.0 ? , stereo in btl mode, the maximum power dissipation, includes 2 channels, plus quiescent power dissipation, dominated by quiescent current. that is to say, to make sure AA4006 can output power into stereo 4 ? speakers continuously, the maximum ambient temperature should be no more than, the maximum power dissipation is achieved only when output power per-channel equals 2*v dd 2/ *r sp . if actual output power is not this data, power dissipation will be less than 2.56w. when junction temper ature exceeds about 165 o c , otsd feature will be enabled, that turns off output amplifiers to prevent damaging the chip. once junction temperature drops lower than 130 o c , the chip will work again automatically. there is an exposed thermal pad on the bottom of the chip to provide the direct thermal path from die to heat sink. it is recommended to use copper on the surface of printed circuit board (pcb) as heat sink. to dig some matrix regular holes under chip, remove mask of this area copper, and make sure to keep them contact well when soldering on pcb ar e also recommended.(see figure 38) recommended pcb layout using wide traces for powe r supply, btl outputs to reduce power losses caused by parasitic resistance is recommended. it is also recommended to place bypass capacitor, and power supply decouple capacitor as close as possible to the chip. ..............................................(8) ja a jmax dmax t t p ? = .......(9) dd dd l p l dd p dbtl i v r v r v v p * 2 * 2 * 2 2 + ? ? ? ? ? ? ? ? ? = .............................(10) dd dd l dd dbtlmax i v r v p * 4 2 2 + = w i v r v p dd dd l dd dbtlmax 56 . 2 0065 . 0 * 0 . 5 4 * 5 * 4 * 4 2 2 2 2 = + = + = c p t t dt ja jmax a = ? = ? = 4 . 16 56 . 2 * 65 150 * application information (continued)
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 22 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited figure 37. time chart for v shutdown , v bias and v out figure 38. recommended pcb layout for heat sink application information (continued)
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 23 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 figure 39. top route and copper application information (continued)
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 24 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited figure 40. bottom route and copper application information (continued)
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 25 bcd semiconductor manufacturing limited aug. 2008 rev. 1. 3 typical application figure 41. typical application of AA4006 left out+ left out- + _ 4 9 + c out 220 f r l 1k ? amp1 amp2 sleeve headphone jack + c out 220 f r l 1.0k ? v dd + c s 10 f left line in c in f 1,12,13,24 7,18,19 gain control mux left hp in c in f left in c in f + _ 5 6 10 right out+ right out- + _ 21 16 amp3 amp4 right line in c in f gain control mux right hp in c in f right in c in f 23 20 8 11 22 cb 1 f shutdown bypass 14 beep in 17 hp/line 2 gain0 3 gain1 15 hp-sense v dd r1 100k ? r12 100k ? 0.47 f cbp vref pc beep u1: AA4006 f + _
2.7w stereo audio power amplifier with 4 selectable gain setups and input mux AA4006 data sheet 26 aug. 2008 rev. 1. 3 bcd semiconductor manufacturing limited unit: mm(inch) mechanical dimensions gage plane 0.250(0.010) seating plane 0.500(0.020) 0.700(0.028) 1.000(0.039) 0 8 0.650(0.026) 0.190(0.007) 0.300(0.012) 1.500(0.059)min 4.300(0.169) 4.500(0.177) 6.200(0.244) 6.600(0.259) 2.700(0.106)min 1.200(0.047)max 0.000(0.000) 0.150(0.005) 112 13 24 tssop-24(edp)
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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